There have already been some teething problems reported about the Apple iPhone 15 series and one of the most disconcerting ones is the apparent overheating issues that have struck the iPhone 15 Pro and iPhone 15 Pro Max. The noted analyst Ming-Chi Kuo has published an article about the situation, stating that the problems are likely caused by the design of the smartphone rather than there being an inherent flaw with TSMC’s base N3 node (N3B), which was used for the Apple A17 Pro SoC.

The commenter actually specifically references the “reduced heat dissipation area” and “use of a titanium frame” as two major contributors to the iPhone 15 Pro overheating problems. Apple used titanium for its iPhone 15 Pro as it made the device lighter than its predecessor, which used stainless steel (iPhone 15 Pro: 187 g/6.6 oz; iPhone 14 Pro: 206 g/7.27 oz). But titanium is not quite as good a thermal conductor as steel, with the latter being seen as a better choice for devices that require more rapid cooling.  

In addition, the analyst reckons the Apple iPhone 15 Pro cooling system has suffered from “compromises” that left it incapable of fully dealing with the A17 Pro’s considerable power. There is hope that a future update could further optimize the processor to help mitigate the thermal issues, but as the overheating problem appears to be caused by a physical design flaw with the iPhone 15 Pro that can’t be rectified with an update, then Apple might find itself experiencing an unwanted sales slump in the near future.

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